A journal of IEEE and CAA , publishes high-quality papers in English on original theoretical/experimental research and development in all areas of automation
Volume 10 Issue 8
Aug.  2023

IEEE/CAA Journal of Automatica Sinica

  • JCR Impact Factor: 15.3, Top 1 (SCI Q1)
    CiteScore: 23.5, Top 2% (Q1)
    Google Scholar h5-index: 77, TOP 5
Turn off MathJax
Article Contents
Q. H. Zhu, B. Li, Y. Hou, H. P. Li, and  N. Q. Wu,  “Scheduling dual-arm multi-cluster tools with regulation of post-processing time,” IEEE/CAA J. Autom. Sinica, vol. 10, no. 8, pp. 1730–1742, Aug. 2023. doi: 10.1109/JAS.2023.123189
Citation: Q. H. Zhu, B. Li, Y. Hou, H. P. Li, and  N. Q. Wu,  “Scheduling dual-arm multi-cluster tools with regulation of post-processing time,” IEEE/CAA J. Autom. Sinica, vol. 10, no. 8, pp. 1730–1742, Aug. 2023. doi: 10.1109/JAS.2023.123189

Scheduling Dual-Arm Multi-Cluster Tools With Regulation of Post-Processing Time

doi: 10.1109/JAS.2023.123189
Funds:  This work was supported in part by the National Natural Science Foundation of China (61673123), the Natural Science Foundation of Guangdong Province, China (2020A151501482), the Science and Technology development fund (FDCT), Macau SAR (0083/2021/A2, 0015/2020/AMJ), and Research Fund of Guangdong-Hong Kong-Macao Joint Laboratory for Intelligent Micro-Nano Optoelectronic Technology (2020B1212030010)
More Information
  • As wafer circuit width shrinks down to less than ten nanometers in recent years, stringent quality control in the wafer manufacturing process is increasingly important. Thanks to the coupling of neighboring cluster tools and coordination of multiple robots in a multi-cluster tool, wafer production scheduling becomes rather complicated. After a wafer is processed, due to high-temperature chemical reactions in a chamber, the robot should be controlled to take it out of the processing chamber at the right time. In order to ensure the uniformity of integrated circuits on wafers, it is highly desirable to make the differences in wafer post-processing time among the individual tools in a multi-cluster tool as small as possible. To achieve this goal, for the first time, this work aims to find an optimal schedule for a dual-arm multi-cluster tool to regulate the wafer post-processing time. To do so, we propose polynomial-time algorithms to find an optimal schedule, which can achieve the highest throughput, and minimize the total post-processing time of the processing steps. We propose a linear program model and another algorithm to balance the differences in the post-processing time between any pair of adjacent cluster tools. Two industrial examples are given to illustrate the application and effectiveness of the proposed method.

     

  • loading
  • [1]
    S. Venkatesh, R. Davenport, P. Foxhoven, and J. Nulman, “A steady state throughput analysis of cluster tools: Dual-blade versus single-blade robots,” IEEE Trans. Semiconductor Manufacturing, vol. 10, no. 4, pp. 418–424, Nov. 1997. doi: 10.1109/66.641483
    [2]
    Y.-H. Shin, T.-E. Lee, J.-H. Kim, and H.-Y. Lee, “Modeling and implementing a real-time scheduler for dual-armed cluster tools,” Computers Industry, vol. 45, no. 1, pp. 13–27, May 2001. doi: 10.1016/S0166-3615(01)00078-1
    [3]
    M. Lee, J. R. Morrison, and A. A. Kalir, “Practical queueing models for preventive maintenance plan optimization: Multiple maintenance types and numerical studies,” IEEE Trans. Semiconductor Manufacturing, vol. 34, no. 1, pp. 104–114, Feb. 2021. doi: 10.1109/TSM.2020.3041789
    [4]
    R. Muñoz and C. Gómez-Aleixandre, “Review of CVD synthesis of graphene,” Chem. Vap. Deposition, vol. 19, no. 10-11-12, pp. 297–322, Dec. 2013. doi: 10.1002/cvde.201300051
    [5]
    N. Q. Wu, C. B. Chu, F. Chu, and M. C. Zhou, “A Petri net method for schedulability and scheduling problems in single-arm cluster tools with wafer residency time constraints,” IEEE Trans. Semiconductor Manufacturing, vol. 21, no. 2, pp. 224–237, May 2008. doi: 10.1109/TSM.2008.2000425
    [6]
    N. Q. Wu, F. Chu, C. B. Chu, and M. C. Zhou, “Petri net modeling and cycle-time analysis of dual-arm cluster tools with wafer revisiting,” IEEE Trans. Systems,Man,and Cybernetics: Systems, vol. 43, no. 1, pp. 196–207, Jan. 2013. doi: 10.1109/TSMCA.2012.2187890
    [7]
    J.-H. Kim and T.-E. Lee, “Schedulability analysis of time-constrained cluster tools with bounded time variation by an extended Petri net,” IEEE Trans. Automation Science and Engineering, vol. 5, no. 3, pp. 490–503, Jul. 2008. doi: 10.1109/TASE.2007.912716
    [8]
    H. J. Yoon and D. Y. Lee, “Online scheduling of integrated single-wafer processing tools with temporal constraints,” IEEE Trans. Semiconductor Manufacturing, vol. 18, no. 4, pp. 390–398, Nov. 2005.
    [9]
    C. Sriskandarajah, I. Drobouchevitch, and S. P. Sethi, “Scheduling multiple parts in a robotic cell served by a dual-gripper robot,” Operations Research, vol. 52, no. 1, pp. 65–82, Feb. 2004. doi: 10.1287/opre.1030.0073
    [10]
    W. M. Zuberek, “Timed petri nets in modeling and analysis of cluster tools,” IEEE Trans. Robotics and Automation, vol. 17, no. 5, pp. 562–575, Oct. 2001. doi: 10.1109/70.964658
    [11]
    M. Meyyappan, “A review of plasma enhanced chemical vapour deposition of carbon nanotubes,” J. Physics D: Applied Physics, vol. 42, no. 21, pp. 213001–213015, Oct. 2009. doi: 10.1088/0022-3727/42/21/213001
    [12]
    W. Liu, S. Kraemer, D. Sarkar, P. M. Ajayan, and K. Banerjee, “Controllable and rapid synthesis of high-quality and large-area Bernal stacked bilayer graphene using chemical vapor deposition,” Chemistry Materials, vol. 26, no. 2, pp. 907–915, Jan. 2014. doi: 10.1021/cm4021854
    [13]
    J.-H. Lee and H.-J. Kim, “Completion time analysis of wafer lots in single-armed cluster tools with parallel processing modules,” IEEE Trans. Autom. Science Engineering, vol. 14, no. 4, pp. 1622–1633, Oct. 2017. doi: 10.1109/TASE.2017.2690443
    [14]
    H.-J. Kim and J.-H. Lee, “Closed-form expressions on lot completion time for dual-armed cluster tools with parallel processing modules,” IEEE Trans. Autom. Science Engineering, vol. 16, no. 2, pp. 898–907, Apr. 2019. doi: 10.1109/TASE.2018.2874664
    [15]
    D.-H. Roh, T.-G. Lee, and T.-E. Lee, “K-cyclic schedules and the worst-case wafer delay in a dual-armed cluster tool,” IEEE Trans. Semiconductor Manufacturing, vol. 32, no. 2, pp. 236–249, May 2019. doi: 10.1109/TSM.2019.2910399
    [16]
    J.-H. Lee, H.-J. Kim, and T.-E. Lee, “Scheduling cluster tools for concurrent processing of two wafer types,” IEEE Trans. Autom. Science Engineering, vol. 11, no. 2, pp. 525–536, Apr. 2014. doi: 10.1109/TASE.2013.2296855
    [17]
    Y. Qiao, N. Q. Wu, F. J. Yang, M. C. Zhou, Q. H. Zhu, and T. Qu, “Robust scheduling of time-constrained dual-arm cluster tools with wafer revisiting and activity time disturbance,” IEEE Trans. Systems,Man,Cybernetics: Systems, vol. 49, no. 6, pp. 1228–1240, Jun. 2019. doi: 10.1109/TSMC.2017.2721979
    [18]
    F. J. Yang, N. Q. Wu, Y. Qiao, and R. Su, “Polynomial approach to optimal one-wafer cyclic scheduling of treelike hybrid multi-cluster tools via Petri nets,” IEEE/CAA J. Autom. Sinica, vol. 5, no. 1, pp. 270–280, Jan. 2018. doi: 10.1109/JAS.2017.7510772
    [19]
    Y. Qiao, N. Q. Wu, F. J. Yang, M. C. Zhou, and Q. H. Zhu, “Wafer sojourn time fluctuation analysis of time-constrained dual-arm cluster tools with wafer revisiting and activity time variation,” IEEE Trans. Systems,Man,Cybernetics: Systems, vol. 48, no. 4, pp. 622–636, Apr. 2018. doi: 10.1109/TSMC.2016.2600583
    [20]
    T. Nishi, Y. Watanabe, and M. Sakai, “An efficient deadlock prevention policy for noncyclic scheduling of multicluster tools,” IEEE Trans. Autom. Science Engineering, vol. 15, no. 4, pp. 1677–1691, Oct. 2018. doi: 10.1109/TASE.2017.2771751
    [21]
    D.-K. Kim, H.-J. Kim, and T.-E. Lee, “Optimal scheduling for sequentially connected cluster tools with dual-armed robots and a single input and output module,” Int. J. Production Research, vol. 55, no. 11, pp. 3092–3109, Jun. 2017. doi: 10.1080/00207543.2016.1243819
    [22]
    X. Li and R. Y. K. Fung, “Optimal k-unit cycle scheduling of two-cluster tools with residency constraints and general robot moving times,” J. Scheduling, vol. 19, no. 2, pp. 165–176, Apr. 2016. doi: 10.1007/s10951-015-0448-7
    [23]
    L. P. Bai, N. Q. Wu, Z. W. Li, and M. C. Zhou, “Optimal one-wafer cyclic scheduling and buffer space configuration for single-arm multicluster tools with linear topology,” IEEE Trans. Systems,Man,Cybernetics: Systems, vol. 46, no. 10, pp. 1456–1467, Oct. 2016. doi: 10.1109/TSMC.2015.2501232
    [24]
    Q. H. Zhu, Y. Qiao, and N. Q. Wu, “Optimal integrated schedule of entire process of dual-blade multi-cluster tools from start-up to close-down,” IEEE/CAA J. Autom. Sinica, vol. 6, no. 2, pp. 553–565, Mar. 2019. doi: 10.1109/JAS.2019.1911411
    [25]
    K. Park and J. R. Morrison, “Controlled wafer release in clustered photolithography tools: Flexible flow line job release scheduling and an LMOLP heuristic,” IEEE Trans. Autom. Science Engineering, vol. 12, no. 2, pp. 642–655, Apr. 2015. doi: 10.1109/TASE.2014.2311997
    [26]
    T. Nishi and I. Matsumoto, “Petri net decomposition approach to deadlock-free and non-cyclic scheduling of dual-armed cluster tools,” IEEE Trans. Autom. Science Engineering, vol. 12, no. 1, pp. 281–294, Jan. 2015. doi: 10.1109/TASE.2013.2292572
    [27]
    W. K. V. Chan, J. G. Yi, and S. W. Ding, “Optimal scheduling of multicluster tools with constant robot moving times, Part I: Two-cluster analysis,” IEEE Trans. Autom. Science Engineering, vol. 8, no. 1, pp. 5–16, Jan. 2011. doi: 10.1109/TASE.2010.2046891
    [28]
    H. N. Geismar, M. Dawande, and S. Chelliah, “Robotic cells with parallel machines: Throughput maximization in constant travel-time cells,” J. Scheduling, vol. 7, no. 5, pp. 375–395, Sept. 2004. doi: 10.1023/B:JOSH.0000036861.28456.5d
    [29]
    M. Dawande, C. Sriskandarajah, and S. Sethi, “On throughput maximization in constant travel-time robotic cells,” Manufacture and Service Operation Manage, vol. 4, no. 4, pp. 296–312, Oct. 2002. doi: 10.1287/msom.4.4.296.5731
    [30]
    D. Jevtic, “Method and apparatus for managing scheduling a multiple cluster tool,” European Patent 1 132 792(A2), Mar. 3, 2001.
    [31]
    Z. Cao, C. Lin, M. Zhou, and R. Huang, “Scheduling semiconductor testing facility by using cuckoo search algorithm with reinforcement learning and surrogate modeling,” IEEE Trans. Autom. Science Engineering, vol. 16, no. 2, pp. 825–837, Apr. 2019. doi: 10.1109/TASE.2018.2862380
    [32]
    Q. H. Zhu, M. C. Zhou, Y. Qiao, and N. Q. Wu, “Petri net modeling and scheduling of a close-down process for time-constrained single-arm cluster tools,” IEEE Trans. Systems,Man,&Cybernetics: Systems, vol. 48, no. 3, pp. 389–400, Mar. 2018.
    [33]
    J. Luo, Z. Liu, M. Zhou, and K. Xing, “Deadlock-free scheduling of flexible assembly systems based on Petri nets and local search,” IEEE Trans. Systems,Man,Cybernetics: Systems, vol. 50, no. 10, pp. 3658–3669, Oct. 2020. doi: 10.1109/TSMC.2018.2855685
    [34]
    J. Luo, M. Zhou, and J. Q. Wang, “AB&B: An anytime branch and bound algorithm for scheduling of deadlock-prone flexible manufacturing systems,” IEEE Trans. Autom. Science Engineering, vol. 18, no. 4, pp. 2011–2021, Oct. 2021. doi: 10.1109/TASE.2020.3029737
    [35]
    B. Huang, and M. Zhou, “Symbolic scheduling of robotic cellular manufacturing systems with timed Petri nets,” IEEE Trans. Control Systems Technology, vol. 30, no. 5, pp. 1876–1887, Sept. 2022. doi: 10.1109/TCST.2021.3123963
    [36]
    S. Wang, X. Guo, O. Karoui, M. Zhou, D. You, and A. Abusorrah, “A refined siphon-based deadlock prevention policy for a class of Petri nets,” IEEE Trans. Systems,Man,Cybernetics: Systems, vol. 53, no. 1, pp. 191–203, Jan. 2023. doi: 10.1109/TSMC.2022.3174421
    [37]
    Q. Zhu, N. Wu, Y. Qiao, and M. Zhou, “Petri net-based optimal one-wafer scheduling of single-arm multi-cluster tools in semiconductor manufacturing,” IEEE Trans. Semiconductor Manufacturing, vol. 26, no. 4, pp. 578–591, Feb. 2013. doi: 10.1109/TSM.2013.2278378
    [38]
    J. G. Yi, S. W. Ding, D. Z. Song, and M. T. Zhang, “Steady-state throughput and scheduling analysis of multi-cluster tools for semiconductor manufacturing: A decomposition approach,” IEEE Trans. Autom. Science Engineering, vol. 5, no. 2, pp. 321–336, Apr. 2008. doi: 10.1109/TASE.2007.906678
    [39]
    N. Q. Wu, and M. C. Zhou, “Modeling, analysis and control of dual-arm cluster tools with residency time constraint and activity time variation based on Petri nets,” IEEE Trans. Autom. Science Engineering, vol. 9, no. 2, pp. 446–454, Apr. 2012. doi: 10.1109/TASE.2011.2178023
    [40]
    N. Q. Wu and M. C. Zhou, “Schedulability analysis and optimal scheduling of dual-arm cluster tools with residency time constraint and activity time variation,” IEEE Trans. Autom. Science Engineering, vol. 9, no. 1, pp. 203–209, Jan. 2012. doi: 10.1109/TASE.2011.2160452
    [41]
    N. Q. Wu and M. C. Zhou, “A closed-form solution for schedulability and optimal scheduling of dual-arm cluster tools with wafer residency time constraint based on steady schedule analysis,” IEEE Trans. Autom. Science Engineering, vol. 7, no. 2, pp. 303–315, Apr. 2010. doi: 10.1109/TASE.2008.2008633
    [42]
    Y. Y. Yan, H. G. Wang, Q. H. Tao, W. H. Fan, T. Y. Lin, and Y. Y. Xiao, “Noncyclic scheduling of multi-cluster tools with residency constraints based on pareto optimization,” IEEE Trans. Semiconductor Manufacturing, vol. 33, no. 3, pp. 476–486, Aug. 2020. doi: 10.1109/TSM.2020.2998734
    [43]
    X. Chen, Y. Xie, Y. Sheng, H. Tang, Z. Wang, Y. Wang, Y. Wang, F. Liao, J. Ma, and X. Guo, “Wafer-scale functional circuits based on two dimensional semiconductors with fabrication optimized by machine learning,” Nature Communications, vol. 12, no. 1, pp. 1–8, Oct. 2021. doi: 10.1038/s41467-020-20314-w
    [44]
    Q. Zhu, M. Zhou, Y. Qiao, N. Wu, and Y. Hou, “Multiobjective scheduling of dual-blade robotic cells in wafer fabrication,” IEEE Trans. Systems,Man,Cybernetics: Systems, vol. 50, no. 12, pp. 5015–5023, Dec. 2020. doi: 10.1109/TSMC.2019.2944866

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Figures(5)  / Tables(3)

    Article Metrics

    Article views (230) PDF downloads(29) Cited by()

    Highlights

    • Aim to ensure high quality of high-end IC chips on a wafer
    • Find an optimal schedule of a dual-arm multi-cluster tool to regulate wafer post-processing time
    • Achieve the highest throughput and minimize the total post-processing time

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return